WebbProduct Information Thermoset™ LS 213-9 encapsulant is a one-component epoxy impregnating compound for use in electrical laminations and potting applications. It can also be used as a reworkable underfill encapsulant. Shelf Life Shelf life is four months when stored refrigerated at 5°C in original, unopened container. Features and Benefits Webb15 feb. 2016 · Thermoset EP-937 Board Level Encapsulant. Thermoset ES-100 Epoxy Encapsulant. Thermoset ES-40 Epoxy Resin. Thermoset Hardener No. 65. Thermoset …

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Thermoset™ LS 213-9 Epoxy Encapsulant LORD Corp

WebbProduct Information. LORD CoolTherm ® ME-525 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes. CoolTherm ME-525 encapsulant is engineered to … http://jjeekk.com/products-and-solutions/electronic-materials/cooltherm-ep6007blk-thermoset-no67-epoxy-system.html WebbThaw encapsulant by placing the syringe in a vertical (upright) position with dispense tip facing downward in an ambient environment. Consult handling instructions** for specifc guidelines. Apply encapsulant by pneumatic-powered syringe or by coating with a disposable applicator. Do not use for coating masses larger than 25 grams. is edgewood high school closed today